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ISL54000, ISL54001, ISL54002
Data Sheet October 17, 2007 FN6458.2
Integrated Audio Amplifier Systems
The Intersil ISL54000, ISL54001, ISL54002 family of devices are integrated audio power amplifier systems that combine stereo BTL 8 amplifiers in a single package. The devices are designed to operate from a single +2.7V to +5V power supply. All devices are offered in a 20 Ld 4x4 thin QFN package. Targeted applications include handheld equipment such as cell-phones, MP3 players, and games/toys. The ISL54000, ISL54001, ISL54002 parts contain two class AB bridge-tied (BTL) type power amplifiers for driving stereo 8 speakers. Each BTL is capable of delivering 800mW (typ) with 0.4% THD+N and 941mW (typ) with 1% THD+N of continuous average power into an 8 BTL speaker load when using a 5V supply. The ISL54001 and ISL54002 feature a 2:1 stereo input multiplexer front-end. This allows selection between two stereo sources. In addition the ISL54002 has the capability of mixing the stereo inputs. All devices in this family feature low power shutdown, thermal overload protection and click/pop suppression. The click and pop circuitry eliminates audible transients during audio source changes and transitioning in and out of shutdown.
Features
* Pb-Free (RoHS Compliant) * Class AB 941mW Stereo BTL Speaker Amplifiiers * Single Supply Operation . . . . . . . . . . . . . . . . .+2.7V to +5.5V * THD+N at 1kHz, 800mW into 8 . . . . . . . . . . . . . . . . . .0.4% * THD+N at 1kHz, 941mW into 8 . . . . . . . . . . . . . . . . . . . 1% * Low Power Shutdown * Thermal Shutdown Protection * "Click and Pop" Suppression Circuitry * 2:1 Stereo Input Mux (ISL54001, ISL54002) * Mixing of Two Stereo Inputs (ISL54002) * TTL Logic-Compatible * Available in 20 Ld 4x4 Thin QFN
Applications
* Battery powered, Handheld, and Portable Equipment - Cellular/mobile Phones - PDA's, MP3 Players, DVD Players, Cameras - Laptops, Notebooks, Palmtops - Handheld Games and Toys * Desktop Computers
ISL54002 Typical Application Circuit and Block Diagram
0.1F 0.22F RIGHT AUDIO 1 0.22F RIGHT AUDIO 2 VDD OUTR+ MUX/MIXER BTL OUTR-
IN1R IN2R
0.22F LEFT AUDIO 1 0.22F LEFT AUDIO 2
IN1L OUTL+ IN2L MUX/MIXER BTL OUTL-
CLICK AND POP
THERMAL PROTECTION
BIAS REF CREF 1F
SD MICRO CONTROLLER INS MIX GND LOGIC CONTROL
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright Intersil Americas Inc. 2007. All Rights Reserved All other trademarks mentioned are the property of their respective owners.
ISL54000, ISL54001, ISL54002 Pinouts
ISL54000 (20 LD 4X4 TQFN) TOP VIEW
GND INR NC NC NC
Pin Descriptions
PIN ISL54000 ISL54001 ISL54002 3, 6, 8, 12 3, 6, 8, 12 3, 6, 8, 12 4, 9, 20
15 NC 14 SD 13 NC
NAME VDD GND INL IN1L IN2L INR IN1R IN2R OUTL+ OUTR+ OUTLOUTRSD
FUNCTION System Power Supply Ground Connection Left Channel Audio Input 1 Left Channel Audio Input 1 Left Channel Audio Input 2 Right Channel Audio Input 1 Right Channel Audio Input 1 Right Channel Audio Input 2 Positive Speaker Output Positive Speaker Output Negative Speaker Output Negative Speaker Output Shutdown, High to disable amplifiers, Low for normal operation. Input Select Mixer, High to mix Right and Left Audio Inputs, Low to pass Audio Inputs without mixing Common-mode Bias Voltage, Bypass with a 1F capacitor to GND No Connect
20 OUTLOUTL+ VDD GND OUTR+ 1 2 3 4 5 6 VDD
19
18
17
16
4, 9, 20 11 13 17 19 2 5 1 7 14
4, 9, 20 11 13 17 19 2 5 1 7 14
11 -
12 VDD 11 INL 7 OUTR8 VDD 9 GND 10 REF
17 2 5 1
ISL54001 (20 LD 4X4 TQFN) TOP VIEW
GND IN2R IN1R 17 INS NC 16 15 NC
20 OUTLOUTL+ VDD GND OUTR+ 1 2 3 4 5 6 VDD
19
18
7
14 SD 13 IN2L 12 VDD 11 IN1L 7 OUTR8 VDD 9 GND 10 REF
14
-
18 -
18 16
INS MIX
ISL54002 (20 LD 4X4 TQFN) TOP VIEW
GND IN2R IN1R MIX INS
10
10
10
REF
20 OUTLOUTL+ VDD GND OUTR+ 1 2 3 4 5 6 VDD
19
18
17
16 15 NC 14 SD 13 IN2L 12 VDD 11 IN1L
13, 15, 16, 18, 19
15, 16
15
NC
7 OUTR-
8 VDD
9 GND
10 REF
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FN6458.2 October 17, 2007
ISL54000, ISL54001, ISL54002 Ordering Information
PART NUMBER PART MARKING TEMP. RANGE (C) PACKAGE (Pb-Free) Tape & Reel PKG. DWG. #
ISL54000 Truth Table
SD 1 0 OUTR+ Disabled INR OUTRDisabled INR OUTL+ Disabled INL OUTLDisabled INL
ISL54000IRTZ* 540 00IRTZ -40 to +85 20 Ld 4x4 TQFN L20.4x4A (Note) (Pb-free) ISL54001IRTZ* 540 01IRTZ -40 to +85 20 Ld 4x4 TQFN L20.4x4A (Note) (Pb-free) ISL54002IRTZ* 540 02IRTZ -40 to +85 20 Ld 4x4 TQFN L20.4x4A (Note) (Pb-free) *Add "-T" suffix for tape and reel. Please refer to TB347 for details on reel specifications. NOTE: These Intersil Pb-free plastic packaged products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate PLUS ANNEAL - e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
ISL54001 Truth Table
SD 1 0 0 INS X 0 1 OUTR+ Disabled IN1R IN2R OUTRDisabled IN1R IN2R OUTL+ Disabled IN1L IN2L OUTLDisabled IN1L IN2L
ISL54002 Truth Table
SD MIX INS 1 0 0 0 X 0 0 1 X 0 1 X OUTR+ Disabled IN1R IN2R IN1R + IN2R OUTRDisabled IN1R IN2R IN1R + IN2R OUTL+ Disabled IN1L IN2L IN1L + IN2L OUTLDisabled IN1L IN2L IN1L + IN2L
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ISL54000, ISL54001, ISL54002
Absolute Maximum Ratings
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +6.5V Input Voltages In_R, In_L, SD, INS, MIX . . . . . . . . . . . . . . -0.3V to (VDD + 0.3V) Output Voltages OUT_+, OUT_-. . . . . . . . . . . . . . . . . . . . . . -0.3V to (VDD + 0.3V) Continuous Current (VDD, OUT_, GND) . . . . . . . . . . . . . . . . 750mA ESD Rating Human Body Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .>2kV Machine Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .>200V Charged Device Model. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .>1kV
Thermal Information
Thermal Resistance (Typical, Notes 1, 2) JA (C/W) JC (C/W) 20 Ld 4x4 TQFN Package . . . . . . . . . . 45 6.5 Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . +150C Maximum Storage Temperature Range . . . . . . . . . . . -65C to +150C Pb-free reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . .see link below http://www.intersil.com/pbfree/Pb-FreeReflow.asp
Operating Conditions
Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . .-40C to +85C
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and result in failures not covered by warranty.
NOTES: 1. JA is measured in free air with the component mounted on a high effective thermal conductivity test board with "direct attach" features. JC, the "case temp" is measured at the center of the exposed metal pad on the package underside. See Tech Brief TB379. 2. For JC, the "case temp" location is the center of the exposed metal pad on the package underside.
Electrical Specifications - 5V Supply
Test Conditions: VDD = +5V, GND = 0V, VINH = 2.4V, VINL = 0.8V, SD = MIX = INS = VINL, CREF = 1F, RL is terminated between OUT_+ and OUT_ -, Unless Otherwise Specified (Note 3). TEST CONDITIONS TEMP (C) MIN (Notes 4, 5) TYP MAX (Notes 4, 5) UNITS
PARAMETER GENERAL Power Supply Range, VDD Quiescent Supply Current, IDD
Full INS = MIX = VINL or VINH, RL = None, Inputs AC coupled to ground (0.1F) SD = VINH, INS = MIX = VINL or VINH, RL = 8 (BTL), Inputs AC coupled to ground (0.1F) INS = 0V or VDD INS = MIX = 0V or VDD 25 Full 25 Full 25 25 25 INS = 0V or 5V, MIX = 0V or 5V Full
2.7 -
4.6 5.5 28 31 100 150 10 1
5.5 12 50 -
V mA mA A A k C C ms
Shutdown Supply Current, ISD
Input Resistance, RIN Thermal Shutdown, TSD Thermal Shutdown Hysteresis SD to Full Operation, TSD(ON) BTL AMPLIFIER DRIVER Output Offset Voltage, VOS
Measured OUT_+ and OUT_-, Input AC coupled to ground (0.1F) VRIPPLE = 200mVP-P, RL = 8, FRIPPLE = 217Hz Input AC coupled to ground FRIPPLE = 1kHz (0.1F) RL = 8, THD + N = 1%, f = 1kHz RL = 8, THD + N = 10%, f = 1kHz
25 Full 25 25 25 25 25 25 25 25 25
7.2 -
38 49 49 47 941 1.23 0.4 0.7 7.7 85 125
-
mV mV dB dB mW W % % VP-P dB VRMS
Power Supply Rejection Ratio, PSRR Output Power, POUT
Total Harmonic Distortion + Noise, RL = 8, POUT = 800mW, f = 1kHz THD + N RL = 8, POUT = 800mW, f = 20Hz to 20kHz Max Output Voltage Swing, VOUT Signal to Noise Ratio, SNR Output Noise, NOUT RL = 8, VSIGNAL = 5VP-P, f = 1kHz RL = 8, POUT = 900mW, f = 1kHz A - Weight filter, BW = 22Hz to 22kHz
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FN6458.2 October 17, 2007
ISL54000, ISL54001, ISL54002
Electrical Specifications - 5V Supply
Test Conditions: VDD = +5V, GND = 0V, VINH = 2.4V, VINL = 0.8V, SD = MIX = INS = VINL, CREF = 1F, RL is terminated between OUT_+ and OUT_ -, Unless Otherwise Specified (Note 3). (Continued) TEST CONDITIONS RL = 8, POUT = 800mW, f = 1kHz, Signal coupled from the input of active amplifier to the output of an adjacent amplifier with its input AC coupled to ground. SD = VINH, POUT = 800mW, f = 10kHz, Signal coupled from input to output of a disabled amplifier. RL = 8, VINxR = VINxL = 3.88VP-P (Connect to the same source) RL = 8, VINxR = VINxL = 3.88VP-P (Connect to the same source) TEMP (C) 25 MIN (Notes 4, 5) TYP 80 MAX (Notes 4, 5) UNITS dB
PARAMETER Crosstalk RCH to LCH, LCH to RCH Off-Isolation Channel Gain Matching RCH to LCH Channel Phase Matching RCH to LCH LOGIC INPUT Input Leakage Current, ISD, IINS, IMIX Input Leakage Current, ISD, IINS, IMIX VINH VINL
25 25 25
-
130 +-0.1 0.01
-
dB dB
VDD = 5V, SD = 0V, INS = 0V, MIX = 0V
25 Full
-3 -1 2.4 -
1.9 1.9 0.02 0.02 -
3 -1 0.8
A A A A V V
VDD = 5V, SD = VDD, INS = VDD, MIX = VDD
25 Full Full Full
Electrical Specifications - 3.6V Supply Test Conditions: VDD = +3.6V, GND = 0V, VINH = 1.4V. VINL = 0.4V, SD = MIX = INS = GSO =
GS1 = VINL, CREF = 1F. RL is terminated between OUT_+ and OUT_ -, Unless Otherwise Specified (Note 3). PARAMETER GENERAL Quiescent Supply Current, IDD INS = 0V or VDD, MIX = 0V or VDD, RL = None, Input AC coupled to ground (0.1F) INS = 0V or VDD, MIX = 0V or VDD, RL = 8 (BTL), Input AC coupled to ground (0.1F) 25 Full 25 Full 2.7 3 13 15 12 50 mA mA A A TEST CONDITIONS TEMP (C) MIN (Notes 4, 5) TYP MAX (Notes 4, 5) UNITS
Shutdown Supply Current, ISD
BTL AMPLIFIER DRIVER, HD = VINH, HO = VINH, UNLESS OTHERWISE SPECIFIED Output Offset Voltage, VOS Measured between OUT_+ and OUT_-, Input AC coupled to ground (0.1F) 25 Full 25 25 25 25 25 25 25 25 40 49 47 310 528 0.4 0.4 5.8 mV mV dB dB mW mW % % VP-P
Power Supply Rejection Ratio, PSRR VRIPPLE = 200mVP-P, RL = 8, FRIPPLE = 217Hz Input AC coupled to ground FRIPPLE = 1kHz (0.1F) Output Power, POUT RL = 8, THD + N = 1%, f = 1kHz RL = 8, THD + N = 10%, f = 1kHz Total Harmonic Distortion + Noise, THD + N Max Output Voltage Swing, VOUT LOGIC INPUT Input Leakage Current, ISD, IINS, IMIX VDD = 5V, SD = 0V, INS = 0V, MIX = 0V RL = 8, POUT = 200mW, f = 1kHz RL = 8, POUT = 200mW, f = 20Hz to 20kHz RL = 8, VSIGNAL = 3.6VP-P, f = 1kHz
25 Full
-3 -
1.9 1.9
3 -
A A
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FN6458.2 October 17, 2007
ISL54000, ISL54001, ISL54002
Electrical Specifications - 3.6V Supply Test Conditions: VDD = +3.6V, GND = 0V, VINH = 1.4V. VINL = 0.4V, SD = MIX = INS = GSO =
GS1 = VINL, CREF = 1F. RL is terminated between OUT_+ and OUT_ -, Unless Otherwise Specified (Note 3). (Continued) PARAMETER TEST CONDITIONS TEMP (C) 25 Full VINH VINL NOTES: 3. VIN = input voltage to perform proper function. 4. The algebraic convention, whereby the most negative value is a minimum and the most positive a maximum, is used in this data sheet. 5. Parts are 100% tested at +25C. Over-temperature limits established by characterization and are not production tested. Full Full MIN (Notes 4, 5) -1 1.4 TYP 0.02 0.02 MAX (Notes 4, 5) UNITS 1 0.4 A A V V
Input Leakage Current, ISD, IINS, IMIX VDD = 5V, SD = VDD, INS = VDD, MIX = VDD
ISL54000 Typical Application Circuit and Block Diagram
0.1F VDD 0.22F RIGHT AUDIO INR BTL OUTROUTR+
0.22F LEFT AUDIO
INL BTL
OUTL+ OUTL-
CLICK AND POP
THERMAL PROTECTION
BIAS REF CREF 1F
MICRO CONTROLLER
SD LOGIC CONTROL
GND
6
FN6458.2 October 17, 2007
ISL54000, ISL54001, ISL54002 ISL54001 Typical Application Circuit and Block Diagram
0.1F 0.22F RIGHT 1 AUDIO 0.22F RIGHT 2 AUDIO VDD OUTR+ IN2R MUX BTL OUTR-
IN1R
0.22F LEFT 1 AUDIO 0.22F LEFT 2 AUDIO
IN1L OUTL+ IN2L MUX BTL OUTL-
CLICK AND POP
THERMAL PROTECTION
BIAS REF CREF 1F
SD MICRO CONTROLLER INS LOGIC CONTROL
GND
ISL54002 Typical Application Circuit and Block Diagram
0.1F VDD OUTR+ 0.22F RIGHT 2 AUDIO IN2R MUX/MIXER BLT OUTR-
0.22F RIGHT 1 AUDIO
IN1R
0.22F LEFT 1 AUDIO 0.22F LEFT 2 AUDIO
IN1L OUTL+ MUX/MIXER IN2L BLT OUTL-
CLICK AND POP
THERMAL PROTECTION
BIAS REF CREF 1F
SD MICRO CONTROLLER INS MIX GND LOGIC CONTROL
7
FN6458.2 October 17, 2007
ISL54000, ISL54001, ISL54002 Detailed Description
The Intersil ISL54000, ISL54001, ISL54002 family of devices are integrated audio power amplifier systems designed to drive 8 speaker loads. They can operate with a supply voltage of +2.7V to +5V and provide good quality audio, while requiring minimal external components. Its low 0.4% THD+N while driving 800mW into an 8 speaker ensures clean, low distortion amplification of the audio signals. The devices are offered in a 20 Ld 4x4 TQFN package. Targeted applications include handheld equipment such as cell-phones, MP3 players, and games/toys. The ISL54000, ISL54001, ISL54002 parts contain two class AB bridge-tied (BTL) type power amplifiers for driving stereo 8 speakers. When powered with a 5V supply, each BTL is capable of delivering 941mW (typ) of continuous average power to an 8 speaker load with 1% THD+N performance. When the speaker load is connected across the positive and negative terminals of the BTL driver, the voltage is doubled across the load and the power is quadrupled. The ISL54001 and ISL54002 feature a 2:1 stereo input multiplexer front-end. This allows selection between two stereo sources. The INS control pin determines which stereo input is active. Applying a logic "0" to the INS control pin selects stereo input 1 (R1 and L1). Applying a logic "1" to the INS control pin selects stereo input 2 (R2 and L2). The ISL54002 has the capability of mixing the two stereo inputs. When in MIX Mode (MIX = "1") the ISL54002 mixes the R1 input with the R2 input and sends the combined signal to the OUTR_ BTL driver and it mixes the L1 input with the L2 input and sends the combined signal to the OUTL_ BTL driver. All devices in this family feature low power shutdown, thermal overload protection and click/pop suppression. The click and pop circuitry prohibits switching between input channels until the audio input signals are at their lowest point, which eliminates audible transients in the speakers when changing audio input sources. The click/pop circuitry also keeps speaker transients to an inaudibile level when entering and leaving shutdown. Typical application circuits and block diagrams for each device in the family are on page 6 and 7. required to calculate the capacitor value is shown in Equation 1:
C 1 6.28 * f * 100k (EQ. 1)
The 100k is the impedance looking into the input of the ISL54000, ISL54001, and ISL54002 devices.
BTL Speaker Amplifiers
The ISL54000, ISL54001, and ISL54002 contain two bridge-tied load (BTL) amplifiers designed to drive a speaker load differentially. The output from one BTL is OUTL+ and OUTL-. The output of the other BTL is OUTR+ and OUTR-. A single BTL driver consists of inverting and non-inverting power op amps. The AC signal out of each op amp are equal in magnitude but 180 out-of-phase, so the AC signal at OUTL+ and OUTL- have the same amplitude but are 180 out-of-phase. The same is true of OUTR+ and OUTR-. The speaker load gets connected between the + terminal and - terminal outputs. Driving the load differentially using a BTL configuration doubles the output voltage across the speaker load and quadruples the power to the load. In effect you get a gain of two due to this configuration at the load as compared to driving the load with a single-ended amplifier with its load connected between a single amplifier's output and ground. The outputs of each BTL are biased at VDD/2. When the load gets connected across the + and - terminal of the BTL, the mid supply DC bias voltage at each output gets cancelled out eliminating the need for large bulky output coupling capacitors.
Low Power Shutdown
With a logic "1" at the SD control pin the device enters the low power shutdown state. When in shutdown the output amplifiers go into an high impedance state and supply current is reduced to 26A (typ). In shutdown mode before the amplifiers enter the high impedance/low current drive state, the bias voltage of VDD/2 remains connected at the output through a 100k resistor. This resistor is not present during active operation of the drivers but gets switched in when the SD pin goes high and disconnected when the SD pin goes low. Leaving the DC bias voltage connected through this 100k resistor reduces the transient that is generated across the speaker, while going into or out of shutdown, to a level that does not produce clicking or popping in the speaker.
DC Bias Voltage
The ISL54000, ISL54001, ISL54002 have internal DC bias circuitry, which DC offsets the incoming audio signal at VDD/2. When using a 5V supply, the DC offset will be 2.5V. When using a 3.6V supply, the DC offset will be 1.8V. Since the signal gets biased internally at VDD/2, the audio signals need to be AC coupled to the inputs of the device. The value of the AC coupling capacitor depends on the low frequency range required for the application. A capacitor of 0.22F will pass a signal as low as 7.2Hz. The formula
QFN Thermal Pad Considerations
The QFN package features an exposed thermal pad on its underside. This pad lowers the package's thermal resistance by providing a direct heat conduction path from the die to the PCB. Connect the exposed thermal pad to GND by using a
FN6458.2 October 17, 2007
8
ISL54000, ISL54001, ISL54002
large copper pad and multiple vias to the GND plane. The vias should be plugged and tented with plating and solder mask to ensure good thermal conductivity. Best thermal performance is achieved with the largest practical copper ground plane area. Proper supply bypassing is necessary for high power supply rejection and low noise performance. A filter network consisting of a 10F capacitor in parallel with a 0.1F capacitor is recommended at the voltage regulator that is providing the power to the ISL54000, ISL54001, and ISL54002 IC. Local bypass capacitors of 0.1F should be put at each VDD pin of the ISL54000, ISL54001, ISL54002 devices. They should be located as close as possible to the pin, keeping the length of leads and traces as short as possible. A 1F capacitor from the REF pin (pin 10) to GND is needed for optimum PSRR and internal bias voltage stability.
PCB Layout Considersations and Power Supply Bypassing
To maintain the highest load dissipation and widest output voltage swing the power supply PCB traces and the traces that connect the output of the drivers to the speaker loads should be made as wide as possible to minimize losses due to parasitic trace resistance.
Typical Performance Curves TA = +25C, Unless Otherwise Specified.
1.0 0.9 VDD = 5V 0.8 BTL 0.7 RL = 8 PO = 800mW 0.6 0.5 THD+N (%) 0.4 0.3 THD+N (%) 20 50 100 200 500 1k 2k FREQUENCY (Hz) 5k 10k 20k 1.0 0.9 VDD = 3.6V 0.8 BTL 0.7 RL = 8 0.6 PO = 200mW 0.5 0.4 0.3
0.2
0.2
0.1
0.1 20 50 100 200 500 1k 2k 5k 10k 20k FREQUENCY (Hz)
FIGURE 1. THD+N vs FREQUENCY
FIGURE 2. THD+N vs FREQUENCY
10.0 VDD = 5V 5.00 BTL RL = 8 2.00 f = 1kHz THD+N (%) THD+N (%) 1.00 0.50 0.20 0.10 0.05 0.02 0.01 10m 20m 50m 100m 200m 500m 1
10.0 VDD = 3.6V 5.00 BTL RL = 8 2.00 f = 1kHz 1.00 0.50 0.20 0.10 0.05 0.02 0.01 10m 20m 40m 70m 100m 200m 600m
OUTPUT POWER (W)
OUTPUT POWER (W)
FIGURE 3. THD+N vs OUTPUT POWER
FIGURE 4. THD+N vs OUTPUT POWER
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FN6458.2 October 17, 2007
ISL54000, ISL54001, ISL54002 Typical Performance Curves TA = +25C, Unless Otherwise Specified. (Continued)
-40 V = 5V -45 DD PO = 800mW -50 -55 -60 -65 -70 -75 -80 -85 -90 -95 -100 -105 -110 -115 -120 20 50 100 -80 -85 -90 -95 -100 -105 -110 -115 -120 -125 -130 -135 -140 -145 -150 -155 -160 20 50 100 200 500 1k 2k 5k 10k 20k FREQUENCY (Hz)
CROSSTALK (dB)
RCH TO LCH
LCH TO RCH VDD = 5V PO = 800mW
200
500
1k
2k
5k
10k 20k
FREQUENCY (Hz)
FIGURE 5. CROSSTALK vs FREQUENCY
OFFISOLATION (dB)
FIGURE 6. OFFISOLATION vs FREQUENCY
-20 -22 VDD = 5V -24 -26 BTL -28 VRIPPLE = 200mVP-P -30 -32 -34 -36 -38 -40 -42 -44 -46 -48 -50 -52 -54 -56 -58 -60 -62 -64 -66 -68 -70 10 20 50 100 200 500 1k FREQUENCY (Hz)
700
POWER DISSIPATION (mW) 2k 5k 10k 20k
VDD = 5V BTL 600 RL = 8 500 400 300 200 100 0
PSRR (dB)
0
250
500 POUT (mW)
750
1000
FIGURE 7. PSRR vs FREQUENCY
FIGURE 8. POWER DISSIPATION vs OUTPUT POWER
400
Die Characteristics
VDD = 3.6V
POWER DISSIPATION (mW)
350 BTL RL = 8 300
SUBSTRATE POTENTIAL (POWERED UP): GND PROCESS:
250 200 150 100 50 0
Submicron CMOS
0
100
200 300 POUT (mW)
400
500
FIGURE 9. POWER DISSIPATION vs OUTPUT POWER
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FN6458.2 October 17, 2007
ISL54000, ISL54001, ISL54002 Thin Quad Flat No-Lead Plastic Package (TQFN) Thin Micro Lead FramePlastic Package (TMLFP)
L20.4x4A
20 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (COMPLIANT TO JEDEC MO-220WGGD-1 ISSUE I) MILLIMETERS SYMBOL A A1 A2 A3 b D D1 D2 E E1 E2 e k L N Nd Ne P 0.20 0.35 1.95 1.95 0.18 MIN 0.70 NOMINAL 0.75 0.02 0.55 0.20 REF 0.25 4.00 BSC 3.75 BSC 2.10 4.00 BSC 3.75 BSC 2.10 0.50 BSC 0.60 20 5 5 0.60 12 0.75 2.25 2.25 0.30 MAX 0.80 0.05 0.80 NOTES 9 9 5, 8 9 7, 8 9 7, 8 8 2 3 3 9 9 Rev. 0 11/04 NOTES: 1. Dimensioning and tolerancing conform to ASME Y14.5-1994. 2. N is the number of terminals. 3. Nd and Ne refer to the number of terminals on each D and E. 4. All dimensions are in millimeters. Angles are in degrees. 5. Dimension b applies to the metallized terminal and is measured between 0.15mm and 0.30mm from the terminal tip. 6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be either a mold or mark feature. 7. Dimensions D2 and E2 are for the exposed pads which provide improved electrical and thermal performance. 8. Nominal dimensions are provided to assist with PCB Land Pattern Design efforts, see Intersil Technical Brief TB389. 9. Features and dimensions A2, A3, D1, E1, P & are present when Anvil singulation method is used and not present for saw singulation.
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems. Intersil Corporation's quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com 11
FN6458.2 October 17, 2007

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